By Kash L. Mittal
A moment overseas symposium on adhesion facets of skinny movies, held in Orlando, Florida in December 2003, improved from the 1st through contemplating metalized plastics and adhesion size. The 17 papers that caught to the publishing strategy transparent to the tip give some thought to such themes as adhesion homes of functionally gradient diamond- like carbon nano-composite motion pictures, characterizing polyethylene-metal composite skinny motion pictures deposited via evaporation, the contribution of chemical reactions among aluminum atoms and sorts of practical teams to the adhesion of aluminum-polymer platforms, and severe occasions saw on copper motion pictures on glass substrate within the micro-scratch try out. there's no index. VSP is a subsidiary of Brill.
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Extra info for Adhesion Aspects of Thin Films
47-57 Ed. L. Mittal C VSP 2007 Fracture and adhesion of thin films on ductile substrates B. A. LATELLA,”* M. IGNAT,2G. TRIANI,’ D. J. CASSIDY’ and J. R. , BP 75, F-38402 Saint Martin d’Hkres, France Abstract-A simple tensile test procedure has been used to investigate the fracture and adhesion behaviour of sol-gel-derived silica and atomic layer deposited titania and alumina thin films on metallic and polymeric substrates. Experiments were performed on the film-substrate systems using small, flat dogbone samples, to enable in situ observation during tensile testing.
Surface free energies of these PTFE thin films were calculated from the contact angles shown in Table 3. The relationship between the surface free energies of the solid (ys), liquid (yL), interfacial free energy between the solid and liquid (ysL) and contact angle (e)can be represented as follows : Y s = YSL + YL * cos@ (1) where ySd, ySp and ysh denote the dispersion, polar and hydrogen-bond components, respectively, of the surface free energy of these PTFE thin films, and, ;y yLp and yrh signify the dispersion, polar and hydrogen-bond components of the surface free energy of water or n-hexadecane or methylene iodide, respectively.
Only the Ta adhesion layer, however, was found to withstand the thermal processing required for PZT sol-gel deposition coupled with the high tensile stress from the silicon nitride, without degrading surface quality via delamination. Keywords: Lead zirconium titanate (PZT); silicon nitride (SijN4) adhesion; MEMS; annealing temperature; adhesion layer thickness; sol-gel processing. 1. INTRODUCTION Lead zirconium titanate (PZT) materials are of particular interest because of their pyroelectric, piezoelectric and ferroelectric properties.